2022 Presentations
Session 1: Practical Bonding Practices
Presentation Materials
- Bonding on Telecommunication Towers
Rohit Narayan, Director Global Telecom, nVent ERICO
- Bonding Technologies-Resilience to Mechanical, Electrical and Environmental Stress
Sam Carbonneau, Product Engineer, Burndy, LLC
- Preview of 2023 NESC and Related IEEE Joint-Use Activities
Trevor Bowmer, Ph.D., Principal, Bunya Telecom Consulting
- Sponsor Presentation: Exothermic Welding Training
Andrew McElroy, Senior Business Development Manager, Harger Lightning & Grounding
Session 2: Grounding for GPR and Lightning Remediation
Presentation Materials
- The Effects of GPR in a Suburban Environment
Mick Maytum, ICT Surge Protection Expert
- Software Designs for Grounding Remediation of Lightning Transient Problems for Solar Fields
Mark Hendricks, Technical Director, DEHN, Inc.
- National Electric Code (NEC) Update
Ernie Gallo, Director-Network Infrastructure Solutions, Ericsson
- Case Study: Use of Nomogram Method to Design Low Resistance Ground for a Central Office
Rohit Narayan, Director Global Telecom, nVent ERICO
- Sponsor Presentation: Simulating the Installation of a Telecom Grounding System Using Exothermic Welding Training
Rohit Narayan, Director Global Telecom, nVent ERICO
Melvin Silvey, Industry Sales Manager, nVent ERICO
Oscar Martinez, Regional Sales Manager, nVent ERICO
Session 3: Electrical Protection / Surge Protection
Presentation Materials
- Surge Protection Modules: The Complete Solution
Jim Pelegris, Director of Technology and Business Development, SETfuse
- A New Universal AC Power Protection Approach
Wayne Dossey, Strategic Marketing Engineer, Circuit Protection Division, Bourns, Inc.
- A Discussion on the Application of NFPA 780 and IEC 62305 in the United States
Mitchell Guthrie, Former Chair, NFPA Committee on Lightning Protection & IEC Technical Committee on Lightning Protection
- Sponsor Presentation: The Critical Installation Choices for Exothermic, Compression and Mechanical Connection Training
Lee Herron, Director Specification Engineering, Burndy, LLC
Kerron Williams, Business Development Manager, Telecommunication & Datacenter, Burndy, LLC
Session 4: New Powering Solutions
Presentation Materials
We use cookies to ensure that we give you the best experience on our website. By continuing to use this site, you consent to these cookies.Ok